1-1747890-1 - TE Connectivity
TE Connectivity
1-1747890-1
1-1747890-1
1-1747890-1
Other Connectors
LGA Land Grid Array Sockets
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Connector System:Board-to-Board
- Connector & Contact Terminates To:Printed Circuit Board
- Product Type:Socket
Configuration Features
- Number of Positions:771
- Grid Spacing:1.17 x 1.09mm[.046 x .043in]
Body Features
- Plating Thickness(µin):15
- Plating Material:Gold
- Frame Style:Open
Contact Features
- Contact Base Material:Copper Alloy
- Socket Type:LGA 771
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness:15
- Contact Current Rating (Max)(A):.8
Mechanical Attachment
- PCB Mounting Style:Surface Mount Solder Ball
- Connector Mounting Type:Board Mount
- Heat Sink Attachment:Without
Housing Features
- Centerline (Pitch)(mm):1.09, 1.17
- Centerline (Pitch)(in):.043, .046
- Housing Color:Black
- Housing Material:High Temperature Thermoplastic
Usage Conditions
- Operating Temperature Range:-25 – 100°C[-13 – 212°F]
Operation/Application
- Circuit Application:Signal
Industry Standards
- UL Flammability Rating:UL 94V-0
Packaging Features
- Packaging Method:Tray
- Tray Color:Blue
Other
- Comment:Lead-Free Solderball
Accessories
Accessories
No details available.
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