1761987-9 TE Connectivity
1761987-9 - TE Connectivity
TE Connectivity
1761987-9
0-1761987-9
Other Connectors
QSFP Pluggable I/O
0
1.200

    

Technical Characteristics

Technical Characteristics

Product Type Features

  • Form Factor:QSFP+
  • Product Type:Connector
  • Included Heat Sink:No
  • Connector System:Board-to-Board
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board

Configuration Features

  • Number of Positions:26

Electrical Characteristics

  • Data Rate (Max)(Gb/s):25

Contact Features

  • PCB Contact Termination Area Plating Material:Tin
  • Contact Current Rating (Max)(A):.5
  • Contact Mating Area Plating Thickness:.76µm[30µin]
  • Contact Mating Area Plating Material:Gold

Termination Features

  • Termination Method to Printed Circuit Board:Surface Mount

Mechanical Attachment

  • Connector Mounting Type:Board Mount

Housing Features

  • Centerline (Pitch):.8mm[.0315in]

Dimensions

  • PCB Thickness (Recommended):1.45mm[.057in]

Usage Conditions

  • Operating Temperature Range:-55 – 105°C[-67 – 221°F]

Operation/Application

  • For Use With Pluggable I/O Products:QSFP+ Cage
  • Circuit Application:Signal

Industry Standards

  • UL Flammability Rating:UL 94V-0

Packaging Features

  • Packaging Method:Reel, Tape

Accessories

Accessories

No details available.