5050871-1 - TE Connectivity
TE Connectivity
5050871-1
0-5050871-1
0-5050871-1
Other Connectors
Mini-Spring Sockets
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Sleeve Style:Open Bottom
- Connector System:Cable-to-Board
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Product Type:Contact
- Profile:Zero
- Wire/Cable Type:Discrete Wire
Body Features
- Sealant:No
- Sleeve Plating Material:Tin
- Sleeve Material:Copper
Contact Features
- Contact Base Material:Beryllium Copper
- Contact Current Rating (Max)(A):7.5
- Contact Type:Socket
- Contact Spring Plating Thickness:.762µm[30µin]
- Contact Spring Plating Material:Gold
- Contact Mating Area Plating Thickness:30µm[30µin]
- Contact Transmits (Typical):Signal (Data)/Power
- Socket Type:Discrete
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Press-Fit
- Termination Method to Wire & Cable:Solder
- Insertion Method:Hand/Semi-Automatic
Dimensions
- Socket Length:7.32mm[.288in]
- Hole Size (Recommended):2.56mm[.101in]
- Wire/Cable Size:.823 – 1.04mm²[18 – 17AWG]
- Mating Pin Diameter Range:1.07 – 1.24mm[.042 – .049in]
- PCB Thickness (Recommended):.79 – 3.18mm[.031 – .125in]
Usage Conditions
- Operating Temperature Range:-65 – 125°C[-85 – 257°F]
Operation/Application
- Circuit Application:Power & Signal
Packaging Features
- Packaging Method:Bag, Loose Piece
- Packaging Quantity:2000
Other
- Spring Material:Beryllium Copper
Accessories
Accessories
No details available.
