5223016-2 - TE Connectivity
TE Connectivity
5223016-2
0-5223016-2
0-5223016-2
PCB-Connectors
2mm FutureBus+ Connectors
5 reih. Stift ,60 pol
5 reih. Stift ,60 pol
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- PCB Connector Assembly Type:PCB Mount Header
- Connector System:Board-to-Board
- Row-to-Row Spacing:2mm[.079in]
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Stabilizers:Press-Fit
- Series:Signal
- Boss:No
- Product Type:Connector
Configuration Features
- Number of Signal Positions:60
- Stackable:No
- PCB Mount Orientation:Vertical
- Number of Positions:60
- Board-to-Board Configuration:Vertical
- Number of Rows:5
- Sequencing:No
Electrical Characteristics
- Impedance(O):60
- Dielectric Withstanding Voltage(VAC):1000
- Voltage(VAC):30
- Insulation Resistance(MO):5
Body Features
- Busbar Mating Area Plating Thickness:1000
Contact Features
- Contact Base Material:Phosphor Bronze
- PCB Contact Termination Area Plating Material:Tin
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness:.05µm[1.9685µin]
- Contact Type:Pin
- Contact Current Rating (Max)(A):3
- Contact Mating Area Plating Material Finish:Matte
- Contact Layout:Matrix
- PCB Contact Termination Area Plating Thickness:.6µm[23.622µin]
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Press-Fit
- Termination Post Length:4.25mm[.167in]
Mechanical Attachment
- PCB Mount Retention Type:Action/Compliant Tail
- Mating Alignment:With
- Mating Alignment Type:Polarization
- PCB Mount Retention:With
- PCB Mount Alignment:Without
- Connector Mounting Type:Board Mount
Housing Features
- Centerline (Pitch):2mm[.079in]
- Housing Material:LCP (Liquid Crystal Polymer)
Dimensions
- PCB Thickness (Recommended)(in):.05
- Mating Post Length:5.75mm[.226in]
- Height:17.8mm[7in]
- Tail Length:.05mm[.167in]
- Width:18mm[.709in]
Usage Conditions
- Operating Temperature Range:-55 – 125°C[-67 – 257°F]
Operation/Application
- Pick and Place Cover:Without
- Circuit Application:Power & Signal
- Solder Process Feature:Board Standoff
Packaging Features
- Packaging Method:Tube
- Packaging Quantity:24
Other
- Comment:Sequencing of the mating posts and lead lengths is available. Worksheets for this procedure may be found under Z-PACK 2mm FB General Information.
Accessories
Accessories
No details available.
