5223514-1 - TE Connectivity
TE Connectivity
5223514-1
0-5223514-1
0-5223514-1
PCB-Connectors
Z-PACK 2mm FB (Future Bus +)
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- PCB Connector Assembly Type:PCB Mount Header
- Connector System:Board-to-Board
- Row-to-Row Spacing:2mm[.079in]
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Series:Signal
- Boss:No
- Stabilizers:Press-Fit
- Product Type:Connector
Configuration Features
- Number of Signal Positions:24
- Stackable:No
- PCB Mount Orientation:Right Angle
- Number of Positions:24
- Board-to-Board Configuration:Right Angle
- Sequencing:No
- Number of Rows:4
Electrical Characteristics
- Impedance(O):24
- Dielectric Withstanding Voltage(VAC):1000
- Voltage(VAC):30
- Insulation Resistance(MO):4
Body Features
- Busbar Mating Area Plating Thickness:1000
Contact Features
- Contact Base Material:Phosphor Bronze
- PCB Contact Termination Area Plating Material:Tin
- Contact Mating Area Plating Material:Gold over Palladium Nickel
- Contact Mating Area Plating Thickness:.05µm[1.9685µin]
- Contact Type:Pin
- Contact Current Rating (Max)(A):3
- PCB Contact Termination Area Plating Thickness:.05µm[1.9685µin]
- Contact Layout:Matrix
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Press-Fit
- Termination Post Length:3.36mm[.132in]
Mechanical Attachment
- PCB Mount Retention Type:Action/Compliant Tail
- Mating Alignment:With
- Mating Alignment Type:Polarization
- PCB Mount Retention:With
- PCB Mount Alignment:With
- Connector Mounting Type:Board Mount
- PCB Mount Alignment Type:Locating Posts
Housing Features
- Centerline (Pitch):2mm[.079in]
- Housing Material:LCP (Liquid Crystal Polymer)
Dimensions
- PCB Thickness (Recommended)(in):.05
- Width:16mm[.622in]
- Mating Post Length:5mm[.197in]
- Height:11.2mm[.44016in]
- Tail Length(in):.131655
Usage Conditions
- Operating Temperature Range:-55 – 125°C[-67 – 257°F]
Operation/Application
- Pick and Place Cover:Without
- Circuit Application:Power & Signal
- Solder Process Feature:Board Standoff
Packaging Features
- Packaging Method:Tube
- Packaging Quantity:49
Accessories
Accessories
No details available.
