533012-3 - TE Connectivity
TE Connectivity
533012-3
0-0533012-3
0-0533012-3
Other Connectors
Military Type Products
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Connector Assembly Type:PCB Mount Receptacle
- Row-to-Row Spacing(mm):2.54, 7.87
- Row-to-Row Spacing(in):.31
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Series:AMPMODU, MOD II
- Connector Type:Connector Assembly
- Profile:Standard
- Boss:No
- Product Type:Connector
Configuration Features
- Stackable:No
- PCB Mount Orientation:Right Angle
- Number of Positions:88
- Number of Rows:2
Contact Features
- Contact Base Material:Beryllium Copper
- PCB Contact Termination Area Plating Material:Gold Flash
- Contact Configuration:Short Point
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness(µin):30
- Contact Type:Socket
- PCB Contact Termination Area Plating Thickness(µin):30
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Solder
- Termination Post Length:4.45mm[.175in]
Mechanical Attachment
- PCB Mount Retention:Without
Housing Features
- Centerline (Pitch):2.54mm[.1in]
- Housing Material:Polyphenylene Sulfide (PPS)
- Housing Entry Style:Side
Dimensions
- Height:6.05mm[.238in]
- Tail Length:4.44mm[.175in]
Operation/Application
- Pick and Place Cover:Without
- Solder Process Feature:Board Standoff
Industry Standards
- MIL-C-55032:No
Packaging Features
- Packaging Method:Tube
- Packaging Quantity:20
Accessories
Accessories
No details available.
