749721-5 - TE Connectivity
TE Connectivity
749721-5
0-0749721-5
0-0749721-5
D-Sub and USB connectors
Steckverbinder|Buchse|PCB|
Polzahl:50|
Polzahl:50|
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Shell Type:Full Metal Shell
- Connector Style:Receptacle
- Connector System:Cable-to-Board
- Row-to-Row Spacing:.1 in, 2.54 mm
- Profile:Standard
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Product Type:Connector
- Connector Type:Connector Assembly
- Shielded:Yes
Configuration Features
- Number of Positions:50
- Number of Rows:2
- PCB Mount Orientation:Vertical
Body Features
- Post Plating Material:Tin-Lead over Nickel
- Post Size(in):.034
- Shell Plating Material:Nickel over Copper
- Shell Material:Carbon Steel
- Bracket Plating Material:Nickel over Copper
- Bracket Material:Zinc
Contact Features
- Contact Base Material:Phosphor Bronze
- PCB Contact Termination Area Plating Material:Tin-Lead
- Contact Current Rating (Max)(A):1
- Contact Mating Area Plating Thickness(µin):30
- Contact Mating Area Plating Material:Gold Flash over Palladium Nickel, Gold
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Solder
- Termination Post Length:3.18mm[.125in]
Mechanical Attachment
- PCB Mount Alignment:Without
- PCB Mounting Style:Through Hole Solder
- PCB Mount Retention:With
- PCB Mount Retention Type:Mounting Hole
- Mating Connector Lock:With
- Mating Connector Lock Type:Latches
- Connector Mounting Type:Board Mount
- Mounting Hole Diameter(in):.109
- Mating Alignment:Without
- Mating Retention Type:Latch
- Mating Retention:With
Housing Features
- Centerline (Pitch):1.27mm[.05in]
- Housing Color:Black
- Housing Material:Thermoplastic
Usage Conditions
- Operating Temperature Range:-55 – 105°C[-67 – 221°F]
Operation/Application
- Circuit Application:Signal
Industry Standards
- UL Flammability Rating:UL 94V-0
Packaging Features
- Packaging Quantity:10
- Packaging Method:Tube
Accessories
Accessories
No details available.
