147444-1 - TE Connectivity
TE Connectivity
147444-1
0-0147444-1
0-0147444-1
Other Connectors
Mini-Spring Sockets
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Sleeve Style:Closed
- Connector System:Cable-to-Board
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Product Type:Contact
- Profile:Zero
Body Features
- Sealant:No
- Sleeve Plating Material:Gold
- Sleeve Material:Copper
Contact Features
- Contact Base Material:Beryllium Copper
- Contact Current Rating (Max)(A):5
- Contact Type:Socket
- Contact Spring Plating Thickness(µin):15
- Contact Spring Plating Material:Gold
- Contact Mating Area Plating Thickness:30µm[30µin]
- Contact Transmits (Typical):Signal (Data)/Power
- Socket Type:Discrete
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Press-Fit
- Termination Method to Wire & Cable:Solder
- Insertion Method:Hand/Semi-Automatic
Dimensions
- Socket Length:5.84mm[.23in]
- Hole Size (Recommended):1.02mm[.04in]
- Mating Pin Diameter Range:.33 – .51mm[.013 – .02in]
Operation/Application
- Circuit Application:Power & Signal
Packaging Features
- Packaging Method:Bag
- Packaging Quantity:2000
Other
- Spring Material:Beryllium Copper
Accessories
Accessories
No details available.
