2-2013311-2 - TE Connectivity
TE Connectivity
2-2013311-2
2-2013311-2
2-2013311-2
Other Connectors
Memory Sockets
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- DRAM Type:Double Data Rate (DDR) 3
- Connector System:Cable-to-Board
- Profile:Reverse
- Row-to-Row Spacing:8.2mm[.322in]
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Product Type:Socket
Configuration Features
- Module Orientation:Right Angle
- Number of Positions:204
- Number of Rows:2
- Keying:Reverse
- Number of Keys:1
- Center Key:Offset Right
- Number of Bays:2
Electrical Characteristics
- DRAM Voltage(V):1.5
Signal Characteristics
- SGRAM Voltage(V):1.5
Body Features
- Ejector Type:Locking
- Module Key Type:SGRAM
- Latch Plating Material:Tin
- Latch Material:Stainless Steel
- Ejector Location:Both Ends
Contact Features
- Contact Base Material:Copper Alloy
- PCB Contact Termination Area Plating Material:Gold
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness:.254µm[10µin]
- Contact Current Rating (Max)(A):.5
- Socket Type:Memory Card
- Socket Style:SO DIMM
Termination Features
- Insertion Style:Cam-In
Mechanical Attachment
- PCB Mount Retention Type:Solder Peg
- PCB Mount Retention:With
- PCB Mounting Style:Surface Mount
- Connector Mounting Type:Board Mount
Housing Features
- Centerline (Pitch):.6mm[.024in]
- Housing Material:High Temperature Thermoplastic
- Housing Color:Black
Dimensions
- Stack Height:9.2mm[.362in]
Usage Conditions
- Operating Temperature Range:-55 – 85°C[-67 – 185°F]
Operation/Application
- Circuit Application:Power
Industry Standards
- UL Flammability Rating:UL 94V-0
Packaging Features
- Packaging Method:Emboss on Reel
- Packaging Quantity:150
Other
- Comment:With floating peg.
Accessories
Accessories
No details available.
