2007193-1 TE Connectivity
2007193-1 - TE Connectivity
TE Connectivity
2007193-1
0-2007193-1
Other Connectors
SFP+ Pluggable I/O
    

Technical Characteristics

Technical Characteristics

Product Type Features

  • Form Factor:SFP+
  • Product Type:Cage Assembly
  • Cage Type:Single
  • Included Heat Sink:Yes
  • Connector System:Cable-to-Board
  • Sealable:No
  • Connector & Contact Terminates To:Printed Circuit Board

Configuration Features

  • Port Matrix Configuration:1 x 1
  • Number of Ports:1

Electrical Characteristics

  • Data Rate (Max)(Gb/s):16

Body Features

  • Heat Sink Style:Pin
  • Heat Sink Height Class:PCI
  • Heat Sink Height:4.2mm[.165in]

Termination Features

  • Termination Method to Printed Circuit Board:Through Hole - Solder

Mechanical Attachment

  • PCB Mounting Style:Through Hole Solder
  • Connector Mounting Type:Board Mount

Housing Features

  • Cage Material:Nickel Silver

Dimensions

  • PCB Thickness (Recommended):1.5mm[.059in]
  • Tail Length:2.8mm[.11in]

Usage Conditions

  • Operating Temperature Range:-55 – 105°C[-67 – 221°F]

Operation/Application

  • For Use With Pluggable I/O Products:SFP+ SMT Connector
  • Pluggable I/O Applications:SFP+
  • Circuit Application:Signal
  • Heat Sink Compatible:Yes

Packaging Features

  • Packaging Method:Box & Tray, Box

Other

  • EMI Containment Feature Type:External Springs
  • Included Lightpipe:No
  • Comment:Meets requirements for PCI applications.

Accessories

Accessories

No details available.