2041119-1 - TE Connectivity
TE Connectivity
2041119-1
0-2041119-1
0-2041119-1
Other Connectors
Memory Sockets
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- DRAM Type:Standard
- Connector System:Board-to-Board
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Row-to-Row Spacing:.8mm[.031in]
- Connector Style:Receptacle
- Center Post:Without
- Product Type:Connector
Configuration Features
- PCB Mount Orientation:Horizontal
- Module Orientation:Right Angle
- Stackable:No
- Number of Positions:52
- Number of Keys:1
- Number of Rows:2
- Center Key:None
Electrical Characteristics
- DRAM Voltage(V):1.5
Body Features
- Ejector Location:None
Contact Features
- PCB Contact Termination Area Plating Material:Gold Flash
- Contact Underplating Material:Nickel
- Contact Base Material:Copper Alloy
- Contact Mating Area Plating Material:Gold
- Contact Current Rating (Max)(A):.5
- Contact Mating Area Plating Thickness(µin):10
Termination Features
- Insertion Style:Cam-In
Mechanical Attachment
- PCB Mount Retention:Without
- PCB Mounting Style:Surface Mount
- Boardlock Plating Material:Tin
- Mating Alignment Type:Polarization
Housing Features
- Centerline (Pitch):.8mm[.031in]
- Housing Material:Thermoplastic
- Housing Color:Black
Dimensions
- Height Above PC Board(in):.157
- Stack Height:4mm[.157in]
Usage Conditions
- Operating Temperature Range:-55 – 85°C[-67 – 185°F]
- High Temperature Housing:Yes
Operation/Application
- Circuit Application:Signal
Industry Standards
- Bus Type:Mini PCI Express
- UL Flammability Rating:UL 94V-0
Packaging Features
- Packaging Method:Tape & Reel
- Packaging Quantity:650
Accessories
Accessories
No details available.
