2085945-4 - TE Connectivity
TE Connectivity
2085945-4
0-2085945-4
0-2085945-4
Connector housing
Stacked Interconnects 2x1
DSR=64 Gb/s
DSR=64 Gb/s
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- Form Factor:QSFP+
- Product Type:Cage Assembly with Integrated Connector
- Included Heat Sink:No
- Cage Type:Stacked
- Connector System:Cable-to-Board
- Sealable:Yes
- Connector & Contact Terminates To:Printed Circuit Board
Configuration Features
- Port Matrix Configuration:2 x 1
- Number of Ports:2
- Rear EONs per Port Column:0
- Number of Positions:76
Electrical Characteristics
- Data Rate (Max)(Gb/s):28
Contact Features
- PCB Contact Termination Area Plating Material:Gold
- Contact Underplating Material:Tin
- Contact Mating Area Plating Thickness:.76µm[30µin]
- Contact Mating Area Plating Material:Gold
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Press-Fit
Mechanical Attachment
- Connector Mounting Type:Board Mount
Housing Features
- Cage Material:Nickel Silver
- Centerline (Pitch):.8mm[.0315in]
Dimensions
- PCB Thickness (Recommended):1.57mm[.062in]
- Tail Length:2.05mm[.08in]
Usage Conditions
- Operating Temperature Range:-55 – 105°C[-67 – 221°F]
Operation/Application
- For Use With Pluggable I/O Products:QSFP Cable Assembly, QSFP MSA Compatible Transceiver
- Pluggable I/O Applications:Standard
- Circuit Application:Signal
- Heat Sink Compatible:No
Industry Standards
- UL Flammability Rating:UL 94V-0
Packaging Features
- Packaging Method:Box & Tray
Other
- EMI Containment Feature Type:Elastomeric Gasket
- Included Lightpipe:No
- Enhancements:Standard
Accessories
Accessories
No details available.