5223004-5 - TE Connectivity
TE Connectivity
5223004-5
0-5223004-5
0-5223004-5
PCB-Connectors
Z-PACK 2mm FB (Future Bus +)
Datasheets
Datasheets
Technical Characteristics
Technical Characteristics
Product Type Features
- PCB Connector Assembly Type:PCB Mount Receptacle
- Connector System:Board-to-Board
- Row-to-Row Spacing:2mm[.079in]
- Sealable:No
- Connector & Contact Terminates To:Printed Circuit Board
- Series:Signal
- Boss:No
- Stabilizers:Solder Post
- Product Type:Connector
Configuration Features
- Number of Signal Positions:150
- Stackable:No
- PCB Mount Orientation:Right Angle
- Number of Positions:150
- Board-to-Board Configuration:Right Angle
- Sequencing:No
- Number of Rows:5
Electrical Characteristics
- Impedance(O):150
- Dielectric Withstanding Voltage(VAC):1000
- Voltage(VAC):30
- Insulation Resistance(MO):5
Body Features
- Busbar Mating Area Plating Thickness:1000
Contact Features
- Contact Base Material:Phosphor Bronze
- PCB Contact Termination Area Plating Material:Tin
- Contact Configuration:Dual Beam
- Contact Mating Area Plating Material:Gold
- Contact Mating Area Plating Thickness:.05µm[1.9685µin]
- Contact Type:Socket
- Contact Current Rating (Max)(A):3
- PCB Contact Termination Area Plating Thickness:3.81µm[149.9997µin]
- Contact Mating Area Plating Material Finish:Matte
- Contact Layout:Matrix
Termination Features
- Termination Method to Printed Circuit Board:Through Hole - Solder
- Termination Post Length:2.73mm[.107in]
Mechanical Attachment
- PCB Mount Retention Type:Hold-Down Post
- Mating Alignment:With
- Mating Alignment Type:Polarization
- PCB Mount Retention:Without
- PCB Mount Alignment:With
- Connector Mounting Type:Board Mount
- PCB Mount Alignment Type:Locating Posts
Housing Features
- Centerline (Pitch):2mm[.079in]
- Housing Material:LCP (Liquid Crystal Polymer)
Dimensions
- PCB Thickness (Recommended)(in):.05
- Height:13.3mm[.52269in]
- Tail Length:.05mm[.107289in]
Usage Conditions
- Operating Temperature Range:-55 – 125°C[-67 – 257°F]
Operation/Application
- Pick and Place Cover:Without
- Circuit Application:Signal
- Solder Process Feature:Board Standoff
Packaging Features
- Packaging Method:Tube
- Packaging Quantity:9
Accessories
Accessories
No details available.
